未来芯片高精尖系列讲座 第六讲

Lam Lecture 2

Graphene and Other 2D Materials:

An Equipment Manufacturer’s Point of View

主讲人：Alex Yoon博士

泛林集团高级技术总监

Senior Technical Director Lam Research Corp.

讲座详情

时间：2017年3月27日（星期一）上午10:30

地点：清华大学信息科学技术大楼（FIT楼）二层多功能厅

主办单位：清华大学微电子学研究所 北京市未来芯片技术高精尖创新中心

主讲人介绍

Alex Yoon博士，泛林集团高级技术总监，负责长期研究和技术开发工作并带领团队在斜角清洁、无电沉积等领域做了很多研发项目。2004年加入公司前，Alex Yoon博士曾任美国应用材料（Applied Materials）公司的技术经理，负责研究金属化学气相沉积（CVD）、原子层沉积（ALD）技术，包括硅化钨、钨的CVD技术以及钨的ALD技术。他曾在PMT、Trikon公司担任过众多技术职务。Yoon博士拥有加州大学伯克利分校的化学工程博士和硕士学位，以及加州大学洛杉矶分校的化学工程学士学位。Lam Research Corporation 是世界知名半导体生产设备制造商,主要从事半导体生产设备、开发、制造、销售及售后服务。

讲座内容

现如今半导体器件面临着高性能、低加工温度、低能耗、高薄膜覆盖率等严苛要求，而随着石墨烯的发现和相关研究的日益深入，二维材料逐渐成为新一代半导体器件材料的有力竞争者。目前二维材料的研究主要集中在石墨烯和过渡金属硫化物中，但石墨烯存在着零带隙、高加工温度、高接触电阻等问题，同时缺乏可靠的硅片级掺杂技术，这些挑战都限制了石墨烯在工业上的大规模应用。其他二维材料虽然有带隙，但同样存在着高加工温度、高接触电阻等问题，同时现有的机械剥离或化学合成法均难以与集成电路工艺兼容。二维材料距离真正的大规模应用还有很长的路要走。

目前设备制造商们正不断研发新工艺、新技术以应对上述挑战，在本次讲座中Alex Yoon博士将介绍目前基于二维材料的半导体器件主要面临的挑战和工业界目前的技术进展，同时将会对二维材料的发展前景进行展望。

Our electronics are constantly evolving. They semiconductor devices that drive them demand higher performance, lower processing temperatures, less power consumption and uniform film coverage. The discovery of single-layer Graphene as one way to meet these challenges kicked off an extensive wave of research in 2D materials.

Graphene and Transition Metal Dichalcogenides are the most actively investigated 2D materials, but graphene as a channel material still remains difficult to implement. No intrinsic band gap, high processing temperatures, high contact resistance and the lack of reliable wafer-scale doping techniques are all limitations. These limitations have pushed researchers to start looking at graphene for back end of line applications.

Other 2D materials also show promise as alternatives to graphene, based on having intrinsic band gaps. But, these materials have similar implementation challenges such as high processing temperatures and high contact resistance. Mechanical exfoliation and chemical methods to grow 2D materials produce flakes that are not compatible with current high volume manufacturing integrated circuit processes.

Newer, more innovative methods are emerging to meet these processing and manufacturing challenges. Semiconductor equipment manufacturers are actively pursuing solutions and, in this presentation, we will outline the challenges that still remain and share progress on key areas of 2D materials research that are showing the most promise for the future.

About Lam Research

泛林集团

泛林集团（Lam Research）是世界知名半导体生产设备制造商，主要从事半导体生产设备、开发、制造、销售及售后服务，其致力于创新的解决方案，生产更快、更精准、更节能的电子产品，产品技术领先业界，在薄膜沉积、等离子刻蚀、光阻去除、晶片清洗等前道工艺方案以及后道的封装应用方面，泛林提供了市场领先的产品和方案组合。通过利用包括工程、研发、制造和客户支持在内的多个领域的专业知识，持续开发行业所需的新功能。

As a leading supplier of wafer fabrication equipment and services to the global semiconductor industry, Lam Research develops innovative solutions to build smaller, faster, more powerful, and more power-efficient electronic devices.The products are used in several steps that arerepeated multiple times throughout the chip-making process, including thin filmdeposition, plasma etch, photoresist strip, and wafer cleaning. Our customer supportofferings are designed to deliver value throughout the equipment lifecycle,from system installation, production ramp, and new technology upgrades throughend-of-life asset management. By drawing on multiple areas of expertise—including engineering, research and development, manufacturing, andcustomer support—we continue to develop the new capabilities required by theindustry.

AboutGraphene

石墨烯

石墨烯（Graphene）是一种由碳原子以sp2杂化方式形成的蜂窝状平面薄膜，是一种只有一个原子层厚度的准二维材料，所以又叫做单原子层石墨。它的厚度大约为0.335nm，根据制备方式的不同而存在不同的起伏，通常在垂直方向的高度大约1nm左右，水平方向宽度大约10nm到25nm，是除金刚石以外所有碳晶体（零维富勒烯，一维碳纳米管，三维体向石墨）的基本结构单元。作为目前发现的最薄、强度最大、导电导热性能最强的一种新型纳米材料，石墨烯被称为“黑金”，是“新材料之王”，科学家甚至预言石墨烯将“彻底改变21世纪”，极有可能掀起一场席卷全球的颠覆性新技术新产业革命。